Design and Thermal Analysis for Reducing the Heat Flux in Heat Sinks Used in CPU

Abstract

The Central processing units (CPU’s) are key component of the almost all electronic gadgets that are used in all sectors like hospitals, banking and industrial sectors etc. In the CPU’s the cooling effect is obtain by the different heat sinks are mounted in that. The heat sinks are play a vital role on CPU’s performance. The effectiveness of Heat sinks are depends on the heat transfers rate and different geometries of heat sink and their materials. In this work, four different heat sink model geometries are designed with using of 3D CATIA Modeling and these models are analyzed by using ansys by changing the three different materials (AL 6061, Bronze and copper) for increasing heat transfers rate from CPU to atmosphere. Based on the results, we found the optimum geometry and best materials for designing the heat sink.