Design Analysis and Comparative Performance Evaluation of Fin in Heat pipe

Abstract

Overheating is the most common problem in electronic components which leads to failure of electronic devices. Normally the fan assisted air cooling is used but limitations of air cooling to liquid cooling in many demanding applications proves that the liquid cooling is more effective and compact. Conventionally liquid cooling component cold plates that include tube embedded in plate aluminum vacuum-brazed and copper brazed types are common in use. Tube-in-plate cold plate materials consist of copper or stainless-steel tubes that are pressed into a channeled aluminium or copper extrusion or machined plate. These devices show moderate performance with high gradient of temperatures and poor performance with low gradients of temperature. Copper heat pipe with Sintered copper mesh with working fluid to be used in the copper heat pipe is ethanol -methanol (60-40 %) with filling ratio of 50 % of volume of heat pipe is used to develop the heat exchanger where in the evaporator and condenser ends carry helical fins in plain and staggered form. Paper work include selection of heat pipes, design, analysis and fabrication of heat pipe enclosure tower as to surface area and number of fins, steady state thermal analysis using Ansys workbench 16.0 is done. Test rig is fabricated and testing has been done by varying flow rate of water (medium for liquid heat load) and flow rate of air. The heat transfer rate, Heat transfer coefficient has been determined for individual cases and then later compared.