NUMERICAL INVESTIGATIONS ON THERMAL MANAGEMENT OF ELECTRONICS MODULE WITH WATER-CUPRIC OXIDE NANOFLUID
Dr. Nirmal Kumar Kund
Associate Professor, Department of Production Engineering Veer Surendra Sai University of Technology, Burla 768018, India , IN
Keywords: Numerical, Simulation, Electronics Module, Water-CuO, Nanofluid
Abstract
The traditional air cooling practice is not at all sufficient for high heat flux electronics devices. The present investigation encompasses an electronics module positioned horizontally at the base, inside a square shaped chamber filled with nanofluid as coolant. The water based nanofluid, namely Water-CuO, is introduced as coolant in the current studies. The numerical studies are carried out to obtain the heat transfer behaviour of electronics module for maintaining its temperature within the safe limit. For that, a 2D numerical model is being developed which also includes thermal buoyancy. The continuity, momentum and energy equations are solved to predict the thermal behaviour. The simulations are accomplished to predict the temperature fields and temperature contours. The trends
of results are along the expected lines. The key model parameter taken is heat flux of 70 W/cm2 accompanying the electronics module. The Water-CuO is found as the nanofluid providing the larger cooling influence to electronics module without any kind of thermal let-down
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